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| Green Electronics » Scope & Content | ||
| Topics: Green electronics design: environmental affections of the design of electronic products and production processes. How to incorporate the life-cycle environmental aspects into the design and production processes. Green electronics assembly: the processes connected to assembling electronics components and also the life-cycle environmental impacts of the materials being used in the processes. These include substrate interconnects as well as components and process equipments used in the assembling of electronics. Green electronics materials: lead (Pb) -free solder pastes, conductive adhesives, halogen-free substrates and components. Substitution of non-recyclable thermosetting polymer based composites with recyclable materials. Strategy & policy: global and regional strategy and policy on green electronics industry. RoHS/WEEE: current status and recent progress of RoHS/WEEE implementation in different countries. RoHS testing technique, RoHS certificate procedure, RoHS solution, and RoHS related equipments. Supply chain: construction and management of effective new green supply chain. Recycle: technology and management on e-waste recycle system construction, 3R, global collaboration, and product disassemble technology. Collaboration: establishment and development of effective collaboration platform between governmental, industrial, educational and other sectors both internationally and regionally. Education and training: ecological education and training for all players in green electronics field. Various education and training methods, such as web-based courses. Short Courses: Lead free soldering for electronics packaging, by Dongkai Shangguan, Flextronics, USA Conductive adhesives for electronics packaging, by Johan Liu, Chalmers University of Technology, Sweden |
